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Prepreg and CCL

 

Material for Lapping and Polishing

 

Material for Jig and Fixture

 

Insulation Metal Substrate

TLM-170(LD)

Low Dk/Df Prepreg and Laminate TLM-170(LD) products are manufactured with a unique high performance resin reinforced with electrical grade  glass fabric and provide the low dielectric constant (Dk) and low dissipation factor (Df) demanded by high speed, low loss Printed Wiring Board (PWB) designs and applications.

TLM-170(LD) offers enhanced thermal resistance due to a high Tg value, lower z-CTE Value and achieve flammability calss of UL94 V-0. These materials are compatible with Lead free process and also exhibit superior chemical resistance, thermal stability and CAF-resistance.

Performance and Processing Advantages

  1. Improved Dielectric properties
  - Dk < 3.8 and Df < 0.0075 (10 GHz)
  2. Excellent electrical performance
  3. Superior dielectric thickness control
  4. Enhanced thermal and chemical resistance
  5. Compatible with automatic optical inspection process
  6. Lead free solder process compatible
  7. CAF-Resistance capability

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Technical data sheet
MSDS (Laminate)
MSDS (Prepreg)